Floor Surface Preparation Machines and Equipment

Removal of urethane thin layer

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Removal of urethane thin layer

Application:

Removes urethane thin layer (thickness: 1.0mm).

Floor Grinder K-20E

Preparation Method:

Apply cutting method to remove the urethane layer.

Floor Grinder K-30

Apply cutter with:

A.Block Tip
K-20用ブロックチップ
B.Tip Cutter (Dia Tip)
ダイヤチップ

Applicable machine:

A. Floor Grinders: K-20E Series
B. Floor Grinders: K-30 Series

Performances:

A. Floor Grinders: 10~15m²/hour; 4~5hrs/set
B. Scarifiers: 25~30m²/hour; 4~5hrs/set

*** The working performance or the cutter consumption may be carrying out differently according to the conditions of flooring materials, floor hardness, adhesiveness and etc at the job sites. ***

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